| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prepreg and a laminated board excellent in impregnatability and drill wearability, and to provide a printed wiring board and a semiconductor device excellent in reliability. <P>SOLUTION: There are provided: a resin composition comprising a filler in which (B) a second filler having a smaller particle size than (A) a first filler is adhered on the outer periphery of (A) the first filler; a prepreg manufactured using the resin composition; and a laminated board, a printed wiring board and a semiconductor device manufactured using the prepreg. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
