发明名称 半導体装置及び半導体装置の製造方法
摘要 <p>A semiconductor apparatus includes a first semiconductor layer formed on a substrate, a second semiconductor layer formed on the first semiconductor layer, a gate recess formed by removing at least a portion of the second semiconductor layer, an insulation film formed on the gate recess and the second semiconductor layer, a gate electrode formed on the gate recess via the insulation film, source and drain electrodes formed on one of the first and the second semiconductor layers, and a fluorine containing region formed in at least one of a part of the first semiconductor layer corresponding to a region in which the gate recess is formed and a part of the second semiconductor layer corresponding to the region in which the gate recess is formed.</p>
申请公布号 JP5728922(B2) 申请公布日期 2015.06.03
申请号 JP20100276381 申请日期 2010.12.10
申请人 发明人
分类号 H01L21/338;H01L21/3065;H01L29/778;H01L29/812 主分类号 H01L21/338
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