发明名称 配線基板、及び半導体パッケージ
摘要 <p>A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a flat-plate shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a flat-plate shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a first signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode.</p>
申请公布号 JP5732357(B2) 申请公布日期 2015.06.10
申请号 JP20110197644 申请日期 2011.09.09
申请人 发明人
分类号 H05K1/02;H01L23/12 主分类号 H05K1/02
代理机构 代理人
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