发明名称 |
Implementing enhanced low loss, thin, high performance flexible circuits |
摘要 |
A method, system and computer program product are provided for implementing enhanced low loss, thin, high performance flexible circuits. A plurality of predefined values including predefined layout, spacing and density of conductor, signal trace construct, shape and feature values are provided for each signal layer in a flexible circuit. Volumetric calculations are performed using the predefined values for each signal layer in the flexible circuit and a respective adjacent adhesive layer is characterized for each signal layer providing a respective optimized adjacent adhesive layer. |
申请公布号 |
US9089071(B2) |
申请公布日期 |
2015.07.21 |
申请号 |
US201213535792 |
申请日期 |
2012.06.28 |
申请人 |
International Business Machines Corporation |
发明人 |
Dangler John R.;Doyle Matthew S. |
分类号 |
G06F19/00;H05K1/18 |
主分类号 |
G06F19/00 |
代理机构 |
|
代理人 |
Pennington Joan |
主权项 |
1. A method for implementing enhanced low loss, thin, high performance flexible circuits performed by a processor, said method comprising:
said processor performing the steps of: receiving a plurality of predefined values including predefined layout, spacing and density of conductor, signal trace construct, shape and feature values for each signal layer in a flexible circuit; performing volumetric calculations using the predefined values for each signal layer in the flexible circuit; and responsive to said volumetric calculations, characterizing a respective adjacent adhesive layer for each signal layer providing an optimized adjacent adhesive layer; and wherein characterizing said respective adjacent adhesive layer for each signal layer providing said optimized adjacent adhesive layer includes strategically reducing an amount of adhesive residing within a signal trace geometry cross section and providing an increased thickness of an electrical insulator polyimide layer having a lower dissipation and dielectric properties, lower coefficient of thermal expansion (CTE), providing a reduced overall cross sectional thickness for the flexible circuit. |
地址 |
Armonk NY US |