SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

摘要

A structure to improve saw singulation quality and wettability of integrated circuit packages (140) is assembled with lead frames (112) having half-etched recesses (134) in leads. In one embodiment, the structure is a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the lead frame strip. In another embodiment, the structure is a semiconductor device package (140) that includes a semiconductor device encapsulated in a package body (142) having a plurality of leads (120). Each lead has an exposed portion external to the package. There is recess (134) at a corner of each lead. Each recess has a generally concave configuration. Each recess is filled with a removable material (300).

主权项

1. A lead frame strip including a plurality of lead frames, comprising:
at least one elongated depression in a bottom surface of the lead frame strip, the at least one depression sized such that it does not cause an opening to occur between the bottom surface and a top surface of the lead frame strip, wherein the at least one elongated depression extends from a lead of a first lead frame to a lead of a second lead frame adjacent to the first lead frame and includes a portion of the lead frame strip between said lead frames; and a material other than a solder wettable material disposed in the at least one elongated depression, wherein the at least one elongated depression becomes, after singulation of the lead frame strip into individual lead frames, a recess at a corner of an end of a lead of at least one of the first lead frame and the second lead frame.