APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK

摘要

An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus has a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

主权项

1. An apparatus comprising:
a vacuum test chamber; a base proximate the bottom of the chamber configured to support and hold a wafer chuck; an annular heater above the chuck and electrically coupled to an external power supply to heat the chuck by radiation, the annular heater having a central opening above the chuck; a window at the top of the chamber to allow infrared radiation to pass through the exterior of the chamber; and an infrared imaging system in view of the window to receive infrared radiation from the chuck through the central opening of the heater and to measure the temperature of the chuck.