发明名称 部品実装方法および部品実装装置
摘要 <p>PROBLEM TO BE SOLVED: To provide a component mounting method and a component mounting device in both of which a plurality of head units can access the same substrate and component mounting can be efficiently performed.SOLUTION: As a result that a priority head unit 3 only is permitted to access an exclusive region ER, mutual interference between the head unit 3 and a head unit 4 can be reliably prevented. Further, the head unit 4 devoid of priority can perform component mounting with respect to regions other than the exclusive region ER, and two head units 3 and 4 can access the same printed circuit board 1 and can perform the component mounting with respect to the same printed circuit board 1. In addition, whenever the priority head unit 3 performs a single mounting operation, previous and subsequent exclusive regions ER of each single mounting operation are compared. When the exclusive region ER is narrowed, the exclusive region ER is reset. When a next mounting point of the head unit 4 exists in the exclusive region ER having been reset, the head unit 4 is moved to a standby position in the vicinity of the exclusive region ER having been reset.</p>
申请公布号 JP5768173(B2) 申请公布日期 2015.08.26
申请号 JP20140169459 申请日期 2014.08.22
申请人 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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