| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a new structure suitable for ensuring thick solder in an electronic apparatus formed by connecting a QFN package with a substrate through solder. <P>SOLUTION: A solder resist 230 overlaps with a peripheral part in a heat sink connection land 210 and solder 300 exists in a portion of the heat sink connection land 210 which is located on the inner side of the solder resist 230. A mold package 100 and the heat sink connection land 210 contact with each other through the overlapped solder resist 230, and the connection structure defines the thickness of the solder 300 between the mold package 100 and the substrate 200. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
