WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board structured such that semiconductor chips can be flip-chip connected thereto in high density and an upper wiring board can be reliably laminated thereon.SOLUTION: The wiring board includes: a first multilayer wiring layer 5 including insulating layers 31 and 32 formed of a non-photosensitive resin; a plurality of external connection pads P formed on the upper surface side of the first multilayer wiring layer 5; and a second multilayer wiring layer 6 which is formed on the first multilayer wiring layer 5, includes insulating layers 33 and 34 formed of a photosensitive resin, and has a narrower wiring pitch than the first multilayer wiring layer 5. The external connection pads P are exposed from the insulating layers 33 and 34 of the second multilayer wiring layer 6.