Semiconductor module

摘要

According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.

主权项

1. A semiconductor module, comprising:
a substrate, which has a first surface and a second surface opposite to the first surface, the second surface comprising a first portion, a second portion, and a third portion intermediate of the first and second portions; a controller device and a memory device disposed on the first surface of the substrate, the controller device disposed opposite to the first portion and the memory device disposed opposite to the second portion; and a metal plate disposed on the second surface of the substrate, wherein the metal plate is disposed at least on the first portion of the second surface corresponding to a position of the controller device thereover, wherein the third portion of the second surface, wherein the metal plate is disposed on the second portion, the metal plate comprises a continuous plate, and a space provided in an uncovered portion of the third portion is a void extending through the metal plate.