发明名称 COOLING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooling structure capable of highly efficiently cooling an entire of a heat sink, and an electronic apparatus using the cooling structure.SOLUTION: An electronic apparatus 1 includes: a heat sink 41 on which an electronic component 5 is mounted; a fan 61 for generating an air flow for cooling the heat sink 41; and passage defining means for defining an air passage 9a for allowing an air flow generated by the fan 61 to pass along the heat sink 41. The air passage 9a includes an upstream side part located on an upstream side in a flow direction of the air flow and a downstream side part located on a downstream side in a flow direction of the air flow. The cross sectional area of the downstream side part decreases toward a downstream side in a flow direction of the air flow.</p>
申请公布号 JP2015185553(A) 申请公布日期 2015.10.22
申请号 JP20140057752 申请日期 2014.03.20
申请人 KYOTO DENKIKI KK 发明人 IKUTAKE ARIHITO
分类号 H05K7/20 主分类号 H05K7/20
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