| 发明名称 |
LED LIGHTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member. |
| 申请公布号 |
US2015311403(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201514686909 |
申请日期 |
2015.04.15 |
| 申请人 |
Citizen Electronics Co., Ltd. ;Citizen Holdings Co., Ltd. |
发明人 |
Katoh Tatsuya;Imai Sadato |
| 分类号 |
H01L33/48;H01L33/50;H01L33/54;H01L33/60;H01L33/62 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An LED lighting apparatus comprising:
an aluminum substrate; a plurality of reflectivity-enhanced layers formed on said aluminum substrate; an LED device bonded on said plurality of reflectivity-enhanced layers; a printed wiring substrate bonded onto a region on said aluminum substrate other than a region where said plurality of reflectivity-enhanced layers are formed; a wire for connecting between said printed wiring substrate and said LED device; a frame member formed so as to surround said LED device; and a phosphor resin deposited over a region inside said frame member. |
| 地址 |
Yamanashi JP |
