发明名称 LASER PROCESSING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a laser processing method which can improve plating reliability, that is, reliability of a printed circuit board by making the axial length of a hole processed from the front face coaxial with that of a hole processed from the rear face.SOLUTION: In a laser processing method where a processing region determined by a size of a f&thetas; lens 13 is irradiated with laser beams with a scanner 12 and the f&thetas; lens 13 to form a through hole in a workpiece w, two sets of scanners 12 and the f&thetas; lenses 13 are provided to make the axes of the two f&thetas; lenses 13 coaxial, and a through hole is processed from both sides of the workpiece w. At this time, one laser beam may be shaped into a clockwise circular polarization laser beam, and the other laser beam may be shaped into a counterclockwise circular polarization laser beam.
申请公布号 JP2015208780(A) 申请公布日期 2015.11.24
申请号 JP20140100934 申请日期 2014.04.23
申请人 ARAI KUNIO;KANETANI YASUHIKO 发明人 ARAI KUNIO;KANETANI YASUHIKO
分类号 B23K26/382;B23K26/082;B23K26/10 主分类号 B23K26/382
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