发明名称 |
METHODS, SYSTEMS, AND COMPUTER READABLE MEDIA FOR DETECTING ELECTRICAL DISCONNECTION BETWEEN INTEGRATED CIRCUIT CHIP ELECTRICAL CONNECTIONS AND CORRESPONDING ELECTRICAL CONTACTS ON A PRINTED CIRCUIT BOARD OR CHIP SOCKET DURING TESTING OF THE CHIP UNDER ENVIRONMENTAL CONDITIONS |
摘要 |
A method for detecting electrical disconnections of a chip during testing under environmental conditions includes providing n monitor connections on a chip from which a voltage or current can be sensed during testing of the chip under environmental conditions, where n is an integer of at least one. M sensing connections are provided on the chip, where m>n. An electrical circuit for electrically connects the n monitor connections with the m sensing connections. The electrical circuit has a characteristic that changes when one or more of the m sensing connections is disconnected from its corresponding contact on the printed circuit board or chip socket. The electrical circuit is monitored via the n monitor connections during the testing. It is determined based on changes in the characteristic, whether one or more of the m sensing connections is disconnected from the printed circuit board or chip socket. |
申请公布号 |
US2015355261(A1) |
申请公布日期 |
2015.12.10 |
申请号 |
US201414299665 |
申请日期 |
2014.06.09 |
申请人 |
SanDisk Technologies Inc. |
发明人 |
Tubul Shai;Bassin Evgeni;Romanov Victor |
分类号 |
G01R31/04 |
主分类号 |
G01R31/04 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for detecting electrical disconnection between integrated circuit chip electrical connections and corresponding electrical contacts on a printed circuit board or a chip socket during testing of the chip under environmental conditions, the method comprising:
providing n monitor connections on an integrated circuit (IC) chip from which a voltage or current can be sensed during the testing of the chip under the environmental conditions, n being an integer of at least one; providing m sensing connections on the chip, the m sensing connections for connecting to the printed circuit board or chip socket during the testing of the chip under the environmental conditions, m being an integer greater than n; providing an electrical circuit for electrically connecting the n monitor connections with the m sensing connections, the electrical circuit having a characteristic that changes when one or more of the m sensing connections is disconnected from its corresponding contact on the printed circuit board or chip socket; and testing the chip, monitoring, via the n monitor connections, the circuit during the testing, and identifying, based on changes in the characteristic, whether one or more of the m sensing connections is disconnected from the printed circuit board or chip socket. |
地址 |
Plano TX US |