| 摘要 |
<p>PURPOSE:To easily and selectively expose only a silicon chip circuit inside a semiconductor integrated device so as to enable it to be evaluated, analyzed, and wired. CONSTITUTION:The surface of a rein package 2 is recessed 6 in a part corresponding to a silicon chip circuit 3. By this setup, solvent is poured into the recess 6, whereby only the silicon chip circuit can be easily exposed.</p> |
