| 摘要 |
<p>PROBLEM TO BE SOLVED: To shorten the time required to mold the package body of an electronic part so as to improve the productivity of the part by forming the winding section of the parts by winding a conductive wire around a support member and the layer insulator of the part by filling up the spaces between the conductor wires with a thermosetting insulating resin, and then, the package by molding an insulation resin so that the package can enclose the entire body of the part. SOLUTION: The winding section 1 of an electronic part is formed by winding a conductive wire 5 around a support member 2. The member 2 of the part is composed of a core formed by molding a ferrite magnetic material, etc., and has a drum-like shape having flange sections 22 and 23 at both ends and a narrow intermediate section 21 between the flange sections 22 and 23. The conductive wire 5 is composed of a conductor coated with an insulation film. The insulation film of the conductor can be formed of polyurethane, etc. A layer insulator is made of a thermosetting insulating resin and fills up the gap formed of the wire 5. The package 4 of the part is made of a thermoplastic insulation resin and covers the entire body of the electronic parts.</p> |
