| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method between a bump and connection electrode so as to improve bonding strength and productivity. SOLUTION: This method makes bonding bonds in plural steps, achieved by increasing both a load applied and an ultrasonic output. Also, the first step bonding, which is heavier than a load just required for leveling a bump height, is applied to contribute to a solid diffused junction between a bump 14 and electrodes 11a and 12a. This bonding creates junction strength larger than from prior methods and improves electronic device reliability. |
