制造化学机械硏磨层之方法;METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS

摘要

所提供的是一种制作研磨层之方法，该研磨层系用于研磨选自磁性基材、光学基材及半导体基材中至少一者之基材，本方法包含：提供液相预聚合物材料；提供复数个中空微球体；将该复数个中空微球体曝露至二氧化碳气氛历经曝露期间，以形成复数个已处理中空微球体；组合该液相预聚合物材料与该复数个已处理中空微球体以形成可固化混合物；允许该可固化混合物进行用以形成已固化材料之反应，其中该反应是在该复数个已处理中空微球体形成之后的小于等于24小时内经允许开始；以及，从该已固化材料衍生至少一层研磨层；其中该至少一层研磨层具有适于研磨基材之该研磨面。; providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.