Reconfigurable connections for stacked semiconductor devices

摘要

Some embodiments include apparatus, systems, and methods comprising semiconductor dice arranged in a stack, a number of connections configured to provide communication among the dice, at least a portion of the connections going through at least one of the dice, and a module configured to check for defects in the connections and to repair defects the connections.

主权项

1. A method comprising:
receiving information at a first scan cell in dice arranged in a stack, the information being provided from a first portion of connections, at least some of the connections going through at least one of the dice; transferring the information from the first scan cell to a second scan cell; transferring the information from the second scan cell to a third scan cell; transferring the information from the third scan cell to a second portion of connections; and checking for defects in the connections based on a value of the information provided from the first portion of connections and a value of the information received at the second portion of connections.