发明名称 Non-volatile memory device with vertical memory cells and method for fabricating the same
摘要 A non-volatile memory device includes a plurality of gate electrodes stacked over a semiconductor substrate and stretched in a first direction along the semiconductor substrate and a plurality of junction layers having a first region protruding from the semiconductor substrate and crossing the gate electrodes and a second region formed between the gate electrodes.
申请公布号 US9214470(B2) 申请公布日期 2015.12.15
申请号 US201414311003 申请日期 2014.06.20
申请人 SK Hynix Inc. 发明人 Ahn Jung-Ryul
分类号 H01L21/8238;H01L27/115;H01L29/66;H01L29/792;H01L21/28 主分类号 H01L21/8238
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A method for fabricating a non-volatile memory device, comprising: forming a stack layer by alternately stacking a first conductive layer, a first insulation layer, and a second insulation layer over a semiconductor substrate; forming first openings and a plurality of gate electrodes that are isolated from each other by the first openings by etching the stack layer; forming a third insulation layer filling the first openings; forming second openings by selectively etching the third insulation layer; forming third openings by removing the second insulation layer that is exposed on sidewalls of the second openings; forming a charge trapping dielectric layer over the semiconductor substrate having the third openings formed therein; and forming a junction layer and a cell channel layer over the charge trapping dielectric layer to fill the second openings and the third openings, respectively.
地址 Gyeonggi-do KR