发明名称 |
Non-volatile memory device with vertical memory cells and method for fabricating the same |
摘要 |
A non-volatile memory device includes a plurality of gate electrodes stacked over a semiconductor substrate and stretched in a first direction along the semiconductor substrate and a plurality of junction layers having a first region protruding from the semiconductor substrate and crossing the gate electrodes and a second region formed between the gate electrodes. |
申请公布号 |
US9214470(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201414311003 |
申请日期 |
2014.06.20 |
申请人 |
SK Hynix Inc. |
发明人 |
Ahn Jung-Ryul |
分类号 |
H01L21/8238;H01L27/115;H01L29/66;H01L29/792;H01L21/28 |
主分类号 |
H01L21/8238 |
代理机构 |
IP & T Group LLP |
代理人 |
IP & T Group LLP |
主权项 |
1. A method for fabricating a non-volatile memory device, comprising:
forming a stack layer by alternately stacking a first conductive layer, a first insulation layer, and a second insulation layer over a semiconductor substrate; forming first openings and a plurality of gate electrodes that are isolated from each other by the first openings by etching the stack layer; forming a third insulation layer filling the first openings; forming second openings by selectively etching the third insulation layer; forming third openings by removing the second insulation layer that is exposed on sidewalls of the second openings; forming a charge trapping dielectric layer over the semiconductor substrate having the third openings formed therein; and forming a junction layer and a cell channel layer over the charge trapping dielectric layer to fill the second openings and the third openings, respectively. |
地址 |
Gyeonggi-do KR |