发明名称 Polishing pad with concentric or approximately concentric polygon groove pattern
摘要 Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.
申请公布号 US9211628(B2) 申请公布日期 2015.12.15
申请号 US201113014630 申请日期 2011.01.26
申请人 NexPlanar Corporation 发明人 Allison William C.;Scott Diane;Simpson Alexander William
分类号 B24B37/00;B24B37/26 主分类号 B24B37/00
代理机构 Blakely Sokoloff Taylor Zafman LLP 代理人 Blakely Sokoloff Taylor Zafman LLP
主权项 1. A polishing pad for polishing a substrate, the polishing pad comprising: a polishing body having a polishing surface and a back surface, the polishing surface having a pattern of grooves comprising concentric or approximately concentric polygons, the pattern of grooves having no radial groove continuous from the inner most polygon to the outer most polygon, wherein all internal angles of each polygon are greater than 90 degrees, wherein each of the polygons has the same number of edges, and wherein the number of edges is determined by the diameter of the polishing pad or by the diameter of the substrate.
地址 Hillsboro OR US