发明名称 |
Producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor device |
摘要 |
A method for producing an encapsulating layer-covered semiconductor element includes a disposing step of disposing a semiconductor element on a support, an encapsulating step of embedding and encapsulating the semiconductor element by an encapsulating layer in an encapsulating sheet including a peeling layer and the encapsulating layer laminated below the peeling layer and made from a thermosetting resin before complete curing, and a heating step of heating and curing the encapsulating layer after the encapsulating step. The heating step includes a first heating step in which the encapsulating sheet is heated at a first temperature, while being mechanically pressurized toward the support and a second heating step in which the encapsulating sheet is heated at a second temperature that is higher than the first temperature after the first heating step. |
申请公布号 |
US9214362(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201314412746 |
申请日期 |
2013.07.17 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
Mitani Munehisa;Ebe Yuki;Ooyabu Yasunari |
分类号 |
H01L21/00;H01L21/56;H01L33/54;H01L23/29;H01L33/56 |
主分类号 |
H01L21/00 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A method for producing an encapsulating layer-covered semiconductor element comprising:
a disposing step of disposing a semiconductor element on a support, an encapsulating step of embedding and encapsulating the semiconductor element by an encapsulating layer in an encapsulating sheet including a peeling layer and the encapsulating layer laminated below the peeling layer and made from a thermosetting resin before complete curing, and a heating step of heating and curing the encapsulating layer after the encapsulating step, wherein the heating step includes a first heating step in which the encapsulating sheet is heated at a first temperature, while being mechanically pressurized toward the support and a second heating step in which the encapsulating sheet is heated at a second temperature that is higher than the first temperature after the first heating step. |
地址 |
Osaka JP |