Solid-state imaging device

摘要

According to one embodiment, there is provided a solid-state imaging device in which vertical signal lines VL1-1, VL1-2, VL2-1, VL2-2, VL3-1, and VL3-2 are respectively arranged between power lines DL1-1, DL1-3, DL2-1, DL2-3, DL3-1, and DL3-3, power lines DL1-2, DL2-2, and DL3-2 are respectively arranged between the vertical signal lines VL1-1, VL1-2, VL2-1, VL2-2, VL3-1, and VL3-2, power lines DL1-1 and DL1-3 are arranged to cross each other in each pixel in the column direction, power lines DL2-1 and DL2-3 are arranged to cross each other in each pixel in the column direction, and power lines DL3-1 and DL3-3 are arranged to cross each other in each pixel in the column direction.

主权项

1. A solid-state imaging device comprising:
a plurality of pixels arranged in rows and columns; a plurality of horizontal controlling lines, each one of the horizontal controlling lines connected to a single row of pixels; a first and a second vertical signal line for each column of pixels, wherein the first vertical signal line is connected to a first group of pixels that are adjacent to each other in the column and the second vertical signal line is connected to a second group of pixels that are adjacent to each other in the column, the first and second groups each including at least two adjacent pixels in the column; and an analog-to-digital (AD) conversion circuit configured to perform analog-to-digital conversions of pixel signals obtained from the plurality of pixels, wherein the first vertical signal line for each column crosses the second vertical signal line for the same column between the first and second groups of pixels in the column.