| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board having no brightness variation among recognition marks due to deposition of a solder paste to openings for the recognition marks, without depositing the solder paste to the openings for the recognition marks. SOLUTION: The manufacturing method comprises an opening forming step (a) of forming openings 106 for forming solder bumps on a resin layer to be a solder resist layer 114 and, at the same time, forming openings 130 for recognition marks outside regions for removing a solder paste in a step (c); a first solder paste printing step (b) of once or more printing the solder pastes on specified regions including a plurality of solder bump forming openings on the solder resist layer, and filling the solder bump forming openings with the paste; a solder paste removing step (c) of removing the solder paste, except the paste filled in the solder bump forming openings, to make the solder paste surface approximately flush with the solder resist layer surface; and a second solder paste printing step (d) of once or more printing the solder paste.</p> |
