| 摘要 |
PROBLEM TO BE SOLVED: To provide: a reliable die bonding material resin composition superior in workability and adhesiveness; and a semiconductor device arranged by use thereof.SOLUTION: A die bonding material resin composition comprises, as essential components: (A) an epoxy resin; (B) an amine-based hardening agent of which the quantity is arranged so that [a mole quantity of an epoxy group in (A) the component/a mole quantity of a group with the epoxy group in (B) the component] is 0.7-1.2; (C)an inorganic filler having an average particle diameter of 0.1-10 μm, of which the content is 20-200 pts.mass to a total of 100 pts.mass of (A) the component and (B) the component; (D) a silane coupling agent, of which the content is 0.1-5 pts.mass to a total of 100 pts.mass of (A)the component and (B)the component; (E) silicone powder, of which the content is 1-30 pts.mass to a total of 100 pts.mass of (A) the component and (B) the component; and (F) thermoplastic resin particles which is solid at 25°C, and of which the content is 1-30 pts.mass to a total of 100 pts.mass of (A) the component and (B) the component. In the case of heating die bonding material resin composition at 150°C for one hour, a volatile matter content is 2 mass% or less. |
