| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which reduces parasitic capacitance in a signal pad and also improves reliability of external connection, and an electronic apparatus.SOLUTION: The wiring board includes: a plurality of pad conductors 2 which are arrayed on a first principal surface of an insulation substrate 1 and include signal pad conductors 2a and grounding pad conductors 2b adjacent to the respective signal pad conductors 2a; and a covering layer 3 which covers the insulation substrate from the first principal surface to an outer peripheral part of the plurality of pad conductors. A plurality of connection pads 4 including signal pads 4a and grounding pads 4b adjacent to the respective signal pads 4a are formed from an exposed portion inside of the outer peripheral part covered by the covering layer 3 in the plurality of pad conductors 2. In a planar view, the grounding pad conductor 2b is larger than the signal pad conductor 2a, and sizes of the signal pad 4a and the grounding pad 4b are equal. |
