| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a fine structure of a metal wiring line, for obtaining a thinner metal wiring line, reducing a cost of manufacturing, and improving both of transmissivity and invisibility of the metal wiring line.SOLUTION: A seed layer 12 is formed on a surface of a substrate 11, on which a photoresist layer 13 is formed on a surface of the seed layer 13, and photolithography and etching processes are carried out to form a groove 14 having a predetermined width in the photoresist layer. An electric plating process is carried out to fill the groove with a conductive layer 15. Then the photoresist layer and a part of the seed layer not covered with the conductive layer are removed to form a fine structure of a metal wiring line. |
