| 摘要 |
PROBLEM TO BE SOLVED: To provide, for example, a wafer holder having a new structure which inhibits variations of temperature distribution of a wafer, and to provide a vapor deposition device.SOLUTION: A wafer holder according to one embodiment includes, for example, a heat receiving part, a heating part, and a contact part. The heat receiving part receives heat from a heat source. The heating part heats a wafer with the heat received by the heat receiving part. The contact part contacts with a peripheral part of the wafer. In the wafer holder, a heat conduction inhibition part which inhibits heat conduction is provided in at least one of the contact part, a space between the heat receiving part and the contact part, and a space between the heating part and the contact part. |
