| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can constantly connect electrodes of a semiconductor element and semiconductor element connection pads of the wiring board normally.SOLUTION: A wiring board comprises semiconductor element connection pads 2 which include: a first pad group which is displaced from an arrangement of electrode terminals T of a semiconductor element S by a certain displacement amount within a range of 5-20 μm in a first direction on a top face of the wiring board; a second pad group which is displaced from the arrangement of the electrode terminals T of the semiconductor element S by the certain displacement amount in a second direction opposite to the first direction on the top face of the wiring board; a third pad group which is displaced from the arrangement of the electrode terminals T of the semiconductor element S by the certain displacement amount in a third direction perpendicular to the first direction and the second direction; and a fourth pad group which is displaced from the arrangement of the electrode terminals T of the semiconductor element S by the certain displacement amount in a fourth direction opposite to the third direction on the top face of the wiring board. |
