| 发明名称 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices |
| 摘要 |
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a semiconductor device comprising an integrated circuit die, connectors disposed over the integrated circuit die, and an insulating material disposed over the connectors and the integrated circuit die. The insulating material is removed from over corner regions of the integrated circuit die, and a molding material is disposed over the insulating material and the integrated circuit die. A top portion of the molding material and the insulating material is removed to expose the connectors. |
| 申请公布号 |
US2015357317(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201414297430 |
申请日期 |
2014.06.05 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Jie;Chen Hsien-Wei |
| 分类号 |
H01L25/00;H01L21/82;H01L23/58;H01L23/544;H01L23/29;H01L25/065;H01L23/538;H01L21/768;H01L21/56;H01L23/31;H01L21/311;H01L23/00 |
主分类号 |
H01L25/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a semiconductor device, the method comprising:
providing a semiconductor device comprising an integrated circuit die, a plurality of connectors disposed over the integrated circuit die, and an insulating material disposed over the plurality of connectors and the integrated circuit die; removing the insulating material from over corner regions of the integrated circuit die; disposing a molding material over the insulating material and the integrated circuit die; and removing a top portion of the molding material and the insulating material to expose the plurality of connectors. |
| 地址 |
Hsin-Chu TW |
