| 发明名称 |
LED PACKAGE IMPROVED STRUCTURE AND FABRICATING METHOD THEREOF |
| 摘要 |
A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated. |
| 申请公布号 |
US2015357538(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201414517936 |
申请日期 |
2014.10.20 |
| 申请人 |
PROLIGHT OPTO TECHNOLOGY CORPORATION |
发明人 |
HSING CHEN Chen-Lun;HUNG Jung-Hao;LIN Ding-Yao |
| 分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A LED (Light-Emitting Diode) package improved structure, comprising:
base having an Iodating space, herein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface; a plurality of metallic nanoparticles covering the bottom surface and/or the side surface; and at least one LED unit disposed in the accommodating space, wherein light emitted from the LED unit is reflected/scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated. |
| 地址 |
TaoYuan County TW |
