| 摘要 |
<p>Provided is a bonding method, which, in a method for manufacturing liquid droplet-discharging head substrates by bonding stacked chips, is capable of bonding in a form that maintains high discharge performance without damaging the nozzle holes . The method comprises : a first process for surface activation of the respective bonding surfaces of first and second plates; a second process for stacking the first and second plates by aligning so that the multiple nozzle holes formed in the first plate and the multiple through holes formed in the second plate communicate with each other; and a third process for bonding the respective bonding surfaces of the stacked first and second plates by atomic bonding that is not associated with covalent bonding, which results from ionic migration. The third process accomplishes the bonding by bringing a load into contact with the liquid droplet-discharging surface of the first plate at a position away from the multiple nozzle holes and pressing the load thereon under atmospheric pressure and by drawing the respective bonding surfaces toward each other with an electrostatic attraction generated therebetween.</p> |
