| 摘要 |
<p>[Problem] To provide an electronic component device and a heat sink having a high degree of design freedom. [Solution] The heat sink results from laminating a plurality of first plate bodies (1) and second plate bodies (2) disposed between the first plate bodies (1) and having a lower height than that of at least the first plate bodies (1). The space formed by the first plate bodies (1) and the second plate bodies (2) is a flow path a fluid to flow through. Such a heat sink can have a higher degree of freedom of design with respect to heat sink shapes necessary depending on application.</p> |
