发明名称 |
PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently reflect light of a light emitting element to radiate the reflected light outward well, and strongly join respective members such as the light emitting element and a bonding wire. <P>SOLUTION: A recessed part 4 for housing the light emitting element 3 therein is formed on the upper surface of an insulation base body 1 formed of ceramics; metallized wiring layers 5a and 5b for electrically connecting electrodes of the light emitting element 3 thereto are formed on the bottom surface of the recessed part 4; surfaces of the metallized wiring layers 5a and 5b are coated with gold-plated layers 9 to be exposed; a metallized metal layer 7 is formed on the inside surface of the recessed part 4; the surface of the metallized metal layer 7 is coated with a silver-plated layer 10 to be exposed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009135536(A) |
申请公布日期 |
2009.06.18 |
申请号 |
JP20090062964 |
申请日期 |
2009.03.16 |
申请人 |
KYOCERA CORP |
发明人 |
KUWATA YOSHIMICHI;FURUMOTO YUICHI;TAMARU HIDEKAZU |
分类号 |
H01L33/48;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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