发明名称 PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To efficiently reflect light of a light emitting element to radiate the reflected light outward well, and strongly join respective members such as the light emitting element and a bonding wire. <P>SOLUTION: A recessed part 4 for housing the light emitting element 3 therein is formed on the upper surface of an insulation base body 1 formed of ceramics; metallized wiring layers 5a and 5b for electrically connecting electrodes of the light emitting element 3 thereto are formed on the bottom surface of the recessed part 4; surfaces of the metallized wiring layers 5a and 5b are coated with gold-plated layers 9 to be exposed; a metallized metal layer 7 is formed on the inside surface of the recessed part 4; the surface of the metallized metal layer 7 is coated with a silver-plated layer 10 to be exposed. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135536(A) 申请公布日期 2009.06.18
申请号 JP20090062964 申请日期 2009.03.16
申请人 KYOCERA CORP 发明人 KUWATA YOSHIMICHI;FURUMOTO YUICHI;TAMARU HIDEKAZU
分类号 H01L33/48;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/48
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