发明名称 PREPREG
摘要 The present invention relates to a prepreg comprising: a core material; a first resin material laminated on an upper portion of the core material; and a second resin material laminated on a lower portion of the core material. A contact interface of the first resin material and the second resin material is placed within a thickness range of the core material, and the first resin material and the second resin material comprise a photoinitiator or a curing booster. In addition, the first resin material has a higher content of the photoinitiator or the curing booster, higher curing degree or higher hardness than the second resin material.
申请公布号 KR20160063022(A) 申请公布日期 2016.06.03
申请号 KR20140166477 申请日期 2014.11.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, KEUN YONG;LEE, SA YONG;SHIN, SANG HYUN
分类号 C08J5/24 主分类号 C08J5/24
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