| 摘要 |
A mounting substrate capable of mounting a plurality of LED chips, wherein the mounting substrate is provided with a heat-conducting part and a wiring pattern. The wiring pattern has a first pattern, and a second pattern that is not in contact with the first pattern. The first pattern has a first comb spine part and first comb tooth parts extending from the first comb spine part. The second pattern has a second comb spine part and second comb tooth parts extending from the second comb spine part. The first comb tooth parts and the second comb tooth parts are alternately arranged along the longitudinal direction of the heat-conducting part. The first pattern has a first slit that opens at one side-edge side of the first comb spine part, opposite the side toward the second comb spine part, and that extends to the first comb tooth parts. The second pattern has a second slit that opens at one side-edge side of the second comb spine part, opposite the side toward the first comb spine part, and that extends to the second comb tooth parts. |
