| 摘要 |
A wafer inspection interface 40 includes a probe card 43 including probes 43b provided on a surface facing a wafer W; a pogo frame 42 that supports a surface of the probe card 43 opposite to the surface on which the probes 43b are provided; a table-shaped chuck member 45 facing the probe card 43 with the wafer W therebetween; a cylindrical bellows 46, configured to seal a space between the chuck member 45 and the pogo frame 42, having one end fastened to the pogo frame 42 and a lower flange 46b at the other end to be contacted with the chuck member 45; a length adjusting device that adjusts a length of the bellows 46; a guide member 47 that guides a movement of the bellows 46; and a decompression path 51 that decompresses the space between the chuck member 45 and the pogo frame 42. |
