SECONDARY-BATTERY-EQUIPPED CIRCUIT CHIP AND MANUFACTURING METHOD THEREFOR

摘要

There are provided a secondary battery-mounted circuit chip in which a secondary battery is directly fabricated on an opposed surface of a formed circuit into an integrated structure of the secondary battery and the circuit, and a manufacturing method thereof. A secondary battery-mounted circuit chip is configured such that a secondary battery is directly fabricated in a region corresponding to a circuit into an integrated structure of the secondary battery and the circuit. The chip is a secondary battery-mounted circuit chip in which the secondary battery is formed on a surface opposing a circuit region fabricated on a wafer. The secondary battery and the circuit are formed into the integrated structure by forming the uppermost part of the circuit having multilayer wiring into a secondary battery structure on the upper part of the circuit surface subjected to passivation, forming the secondary battery directly stacked by making the uppermost wiring layer of the multilayer wiring part of the circuit in a surface structure to be used in common, or forming the secondary battery on the rear surface of the substrate having the circuit formed thereon.