| 摘要 |
A semiconductor package fixation device for fixating a semiconductor package in the bottom of the semiconductor package having a plurality of ball terminals formed therein with a predetermined pattern in a lower surface, comprises: a body and a protrusion pad. The body has a hollow hole which is penetrated to provide vacuum pressure in the center. The protrusion pad is protruded to have an enclosed space including the hollow hole from an upper surface of the body to between the ball terminals, and adhesively fixates the semiconductor package by the vacuum pressure provided to the enclosed space from the hollow hole. |
