| 摘要 |
According to one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece comprises the steps of: electrochemically depositing a metallization layer on a seed layer formed on the workpiece using a plating electrolyte in a pH range of about 1 to about 6 having at least one plating metal ion; and applying a cathodic potential in the range of about -0.5 V to about -4 V. The workpiece comprises a barrier layer disposed between the seed layer and a dielectric surface of the workpiece wherein the barrier layer comprises first metal having a standard electrode potential more negative than 0 V and the seed layer comprises second metal having a standard electrode potential more positive than 0 V. |
