Heat dissipation substrate and method for manufacturing the same

摘要

A heat dissipation substrate comprises a substrate material and a heat conductive liquid. The substrate material comprises a plurality of holes and the heat conductive liquid is permeated into the holes. The thermal expansion coefficient of the heat conductive liquid is larger than that of the substrate material. A heat dissipation substrate manufacturing method comprises steps of mixing a sinter powder and an adhesive to form a substrate material; placing the substrate material into a furnace to perform a sintering process in order to form a plurality of holes in the substrate material; and permeating a heat conductive liquid into the holes.

主权项

1. A manufacturing method of a heat dissipation substrate comprising steps of:
mixing a sinter powder and an adhesive to form the substrate material; placing the substrate material into a furnace to perform a sintering process in order to form a plurality of holes in the substrate material; and permeating a heat conductive liquid into the holes, wherein the sinter powder includes aluminum, copper or tungsten, the adhesive includes a solvent of calcium oxide-aluminum oxide-silicon dioxide (CaO—Al2O3—SiO2), a solvent of magnesium-aluminum oxide-silicon dioxide (Mg—Al2O3—SiO2) or a solvent of manganese monoxide-magnesium oxide-aluminum oxide-silicon dioxide (MnO—MgO—Al2O3—SiO2).