Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits

摘要

A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

主权项

1. An arrangement for providing an electrical connection between a first device and a second device for communicating a complementary-encoded data signal therebetween, defined as a DATA signal component and a DATA signal component, the arrangement comprising:
an array of parallel signal paths disposed between the first device and the second device, the array including:
a first set of signal paths for carrying the DATA signal component; anda second set of signal paths for carrying the DATA signal component,wherein the signal paths forming the first set and the second set are interleaved such that oppositely-signed signals are carried on adjacent signal paths.