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发明名称
method for treating substrate
摘要
<p>본 발명은 기판 처리 방법을 개시한다. 그의 방법은, 기판 상의 절연 층을 습식 용액에 노출하여 상기 절연 층의 상부 면에 상기 친수성 부산물들을 형성하는 단계와, 상기 절연 층의 상부 면에서 친수성 부산물들을 제거하는 단계와, 상기 절연 층을 식각하는 단계를 포함한다.</p>
申请公布号
KR101575131(B1)
申请公布日期
2015.12.08
申请号
KR20130144792
申请日期
2013.11.26
申请人
피에스케이 주식회사
发明人
신평수
分类号
H01L21/306;H01L21/3065
主分类号
H01L21/306
代理机构
代理人
主权项
地址
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