Method of manufacturing embedded wiring board

摘要

A manufacturing method of an embedded wiring board is provided. The method includes the following steps. First, an insulation layer and a lower wiring layer are provided, wherein the insulation layer includes a polymeric material. Then, the plural catalyst grains are distributed in the polymeric material. A groove and an engraved pattern are formed on the upper surface. A blind via is formed on a bottom surface of the groove to expose the lower pad. An upper wiring layer is formed in the engraved pattern. Some catalyst grains are exposed and activated in the groove, the engraved pattern and the blind via. A first conductive pillar is formed in the groove. Finally, a second conductive pillar is formed in the blind via.

主权项

1. A manufacturing method of an embedded wiring board, comprising:
providing an insulation layer and a lower wiring layer, wherein the insulation layer includes a polymeric material, the insulation layer is provided with an upper surface and a lower surface opposite to the upper surface, the lower wiring layer is located at the lower surface and includes a lower pad which is embedded in the lower surface; distributing a plural catalyst grains in the polymeric material; forming a groove and an engraved pattern on the upper surface, wherein a depth of the groove relative to the upper surface is larger than a depth of the engraved pattern relative to the upper surface; fondling a blind via on a bottom surface of the groove to expose the lower pad; exposing and activating some catalyst grains in the groove, the engraved pattern, and the blind via; forming an upper wiring layer in the engraved pattern; forming a first conductive pillar in the groove; and forming a second conductive pillar in the blind via, wherein the second conductive pillar is connected between the first conductive pillar and the lower pad.