Methods for the manufacture of high efficiency backlight assemblies for flat panel display assemblies

摘要

A backlight assembly is provided for deployment within a flat panel display assembly, as are methods for manufacturing such a backlight assembly. In one embodiment, the method includes the steps of fabricating a printed wiring board (PWB) having a display-facing surface, disposing a casing sidewall around the PWB to create light cavity within the backlight assembly, and electrically coupling a plurality of light emitting diodes (LEDs) to the PWB. A reflective solder mask is deposited over the display-facing surface of the PWB, and a first reflective silkscreen layer is applied over the reflective solder mask utilizing a silkscreen process. The first reflective silkscreen layer cooperates with the reflective solder mask to increase the reflectivity of the light cavity over the visible color spectrum.

主权项

1. A method for manufacturing a backlight assembly suitable for deployment within a flat panel display assembly, the method comprising:
fabricating a printed wiring board (PWB) having a display-facing surface; disposing a casing sidewall around the PWB to create light cavity within the backlight assembly; electrically coupling a plurality of light emitting diodes (LEDs) to the PWB; depositing a white solder mask over the display-facing surface of the PWB; and applying a first white silkscreen layer over the white solder mask utilizing a silkscreen process, the first white silkscreen layer applied directly onto the outer face of the white solder mask such that the first white silkscreen layer contacts and is substantially contiguous with the white solder mask, the first white silkscreen layer cooperating with the white solder mask to increase the reflectivity of the light cavity over the visible color spectrum.