Reduced PTH pad for enabling core routing and substrate layer count reduction

摘要

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

主权项

1. An apparatus, comprising:
a substrate core comprising a resin extending throughout the substrate core, and glass fibers and filler material within the resin; at least one resin rich outer area within the substrate core; a plurality of plated through holes (PTHs) extending through the substrate core to provide vertical electrical paths through the core, the PTHs having a diameter of approximately 100 μm at a top and bottom side of the core; and a plurality of trace lines between the PTHs having line spacing (L/S) of approximately 20 μm/20 μm.