Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board

摘要

The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

主权项

1. An epoxy resin composition for a prepreg obtained by blending a pre-reacted epoxy resin, an epoxy resin which is not pre-reacted, a hardening agent, an inorganic filler, and a molybdenum compound, wherein:
the pre-reacted epoxy resin is obtained by reacting a phosphorus compound with (i) a bifunctional epoxy resin and a multi-functional epoxy resin, or (ii) the bifunctional epoxy resin only, in advance, the epoxy resin which is not pre-reacted is a bifunctional epoxy resin or a multi-functional epoxy resin when the pre-reacted epoxy resin is obtained by reacting the phosphorus compound with (i), the epoxy resin which is not pre-reacted is a multi-functional epoxy resin when the pre-reacted epoxy resin is obtained by reacting the phosphorus compound with (ii), the phosphorus compound has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element, the bifunctional epoxy resins have 1.8 or more and less than 2.6 on average of epoxy groups in the molecule, the multi-functional epoxy resins contain 2.8 or more on average of epoxy groups in one molecule, and the inorganic filler is used in a blending amount of 110 parts or more by mass and less than 200 parts by mass with respect to 100 parts by mass total of the pre-reacted epoxy resin and the epoxy resin which is not pre-reacted.