| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a copper foil laminate sheet having a carrier layer composed of an aluminum-based material causes diffusion between aluminum and copper, leading to difficulty of peeling of the aluminum layer serving as a carrier layer, in a production process of copper foil constituting a print circuit board and provide a layer formation technique which facilitates peeling and gives uniform surfaces of copper foil.SOLUTION: A production technique of a substrate 200 having copper foil 230 includes a step of forming a porous layer 241 on the surface of a carrier layer 240, as a separation induction layer, by electroless corrosion in the presence of an alkali compound or the like, finishing the separation induction layer by conducting e.g. a sealing treatment with cobalt chromium or the like and then forming a copper foil layer 230 on the separation induction layer and a step of joining a core 210 onto the copper foil layer 230. |
