发明名称 SOLID MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve problems for example, when increasing travel speed of flattening means, powder bodies soar, therefore molding speed cannot be increased.SOLUTION: A solid molding device comprises: a supply tank 21 for supplying powder bodies 20; a molding tank 22 to which the powder bodies 20 are supplied from the supply tank 21, and on which molding layers 30 formed by binding the powder bodies are laminated and molded; and a flattening roller 12 for transferring and supplying the powder bodies 20 from the supply tank 21 to the molding tank 22, flattening a surface of the powder bodies 20 on the molding tank 22 for forming a powder body layer. The flattening roller 12 is rotated in a forward direction to the travel direction on the supply tank 21 side, and is rotated in a reverse direction to the travel direction on the molding tank 22 side.
申请公布号 JP2015217587(A) 申请公布日期 2015.12.07
申请号 JP20140102459 申请日期 2014.05.16
申请人 RICOH CO LTD 发明人 ONO TAIICHI
分类号 B29C67/00 主分类号 B29C67/00
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