| 摘要 |
PROBLEM TO BE SOLVED: To provide: an adhesive film integrated surface protective film capable of highly accurately and simply manufacturing a semiconductor chip without using an underfill and an NCP; and a method for manufacturing a semiconductor chip using an adhesive film integrated surface protective film.SOLUTION: In a manufacturing process for a semiconductor chip, a semiconductor wafer 1 used in a flip-chip mounting process and having a bump electrode is subjected to rear face 1B grinding, and simultaneously or at the following step, the wafer is diced into chips (separated into individual pieces). There is provided an adhesive film integrated surface protective film 3 used in the manufacturing process for a semiconductor chip and having an adhesive layer 5 on a base material film 4, an adhesion film 6 being laminated on the adhesive layer. The base material film has at least one layer comprising a (meth)acrylic copolymer. There is also provided a method for manufacturing a semiconductor chip. |
